Author: Hans J. Greub
Publication Overview
Publication period start: 1987
Number of co-authors: 4
Co-Authors
Number of publications with favourite co-authors
Productive Colleagues
Most productive colleagues in number of publications
Publications
McDonald,
Jack F.,
Greub,
Hans J.,
Steinvorth,
Randy H.,
Donlan,
Brian J.,
Bergendahl,
Albert S.
(1987):
Wafer Scale Interconnections for GaAs Packing - Applications to RISC Architecture.
In
IEEE Computer,
20
(4)
pp. 21-35.